Dimensions | 610 mm * 710 mm Max. 50 mm * 50 mm Min. |
Materials | FR4/CEM-1/Aluminium/PFTE/Rogers |
Board Thickness | 0.3-2.4 mm, 3.2mm prototypes available |
Flash Gold/Electrolytic Gold/OSP/ENIG/HASL/Lead Free HASL/Immersion Silver/Immersion Tin/Carbon Ink
3 mils / 4 mils Blind vias that connect any layers are not supported.
Please inquire if types of HDI stackups are III or higher orders.
Others +
Dimensions | 610 mm * 710 mm Max. 50 mm * 50 mm Min. |
Materials | FR4/CEM-1/Aluminium/PFTE/Rogers |
Board Thickness | 0.3-2.4 mm, 3.2mm prototypes available |
Inner Layers +
Trace / Space | Etch compensation for inner layer cores (applicable to wet film cores only) | |||||||||||
Compensation widths (um) | Gaps after compensation (um) | Annular ring after compensation (um) | Artwork gaps before compensation (um) | Artwork trace widths before compensation (um) | ||||||||
Base copper weight | Individual traces | Normal | Min. | Normal | Min. | Normal | Local Min. | Normal | Min. | Normal | Min. | |
0.33 / H OZ | 36 | 26 | 16 | 70 | 56 | 150 | 90 | 89 | 76 | 89 | 76 | |
1.5 OZ | 50 | 45 | 35 | 80 | 80 | 180 | 120 | 125 | 115 | 106 | 80 | |
2 OZ | 70 | 60 | 50 | 100 | 100 | 250 | 150 | 160 | 150 | 150 | 120 | |
2.5 OZ | 110 | 90 | 80 | 110 | 110 | 280 | 230 | 200 | 190 | 165 | 135 | |
3 OZ | 140 | 120 | 100 | 120 | 120 | 300 | 250 | 240 | 220 | 180 | 150 | |
4 OZ | 190 | 140 | 120 | 150 | 130 | 400 | 350 | 310 | 250 | 250 | 200 | |
5 OZ | 230 | 200 | 180 | 180 | 150 | 450 | 380 | 380 | 330 | 250 | 200 | |
6 OZ | 280 | 250 | 220 | 250 | 200 | 530 | 470 | 500 | 420 | 280 | 250 | |
Annular Ring | Refer to the above table | |||||||||||
Prepregs with DK 4.2-4.6 | 1080: 3-3.35 mils in thickness 2116: 4.53-5.12 mils in thickness 7628: 7.56-8.46 mils in thickness 2113: 4 mils in thickness 106: 2-2.36 mils in thickness 1506 (not recommended): 6.3 mils in thickness 7630 (not recommended): 8 mils in thickness |
Drill +
Dimensions | Max.: 690 mm * 885 mm Max. Panel Dimensions: 620 mm * 725 mm |
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Min. Drill Size | 0.2 mm | |||
Max. Drill Size | 6.35 mm | |||
Min. Diameter-to-Thickness Ratio | 1 : 12 | |||
Drilling Compensation | Finished diameter: D; Tolerance Upper Limit: L; Min. Wall Thickness (Single point): H | |||
Board Thickness(mm) | Surface Finish | Compensation Calculator (L ≤ 0.076mm, L = 0.076mm if the upper limit is larger than 0.076mm) |
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Non Crimp PTHs | Crimp PTHs | |||
< 1.0 | HASL | D+L+(H+0.005)*2+0.01 | D+L+H*2 | |
Non-HASL | D+L+(H+0.005)*2 | D+L+H*2 | ||
1.0 ≤ x < 5.0 | HASL | D+L+(H+0.005)*2+0.01 | D+L+H*2+0.01 | |
Non-HASL | D+L+(H+0.005)*2 | D+L+H*2 | ||
≥ 5.0 | HASL | D+L+(H+0.005)*2+0.02 | D+L+H*2+0.02 | |
Non-HASL | D+L+(H+0.005)*2+0.01 | D+L+H*2+0.01 |
Outer Layers +
Etching … | 2nd Outer-most / Outer Layer Compensation | |||||||||||||
50 ≤ x < 60 | 25 | 20+/-4 | 40 | 100 ≤ X+Y | 10 | 45<Y1≤ 55 55<Y1≤ 65 65<Y1≤75 75<Y1≤85 Y1>85 |
5 9 12 14 19 |
40 | 60 | 50 | 25 um as compensation width should be priorly applied | For plated through holes, | ||
60 ≤ x <70 | 30 | 25+/-4 | 50 | 120 ≤ X+Y | 10 | 55<Y1≤ 65 65<Y1≤75 75<Y1≤85 85<Y1≤ 95 Y1>95 |
6 10 13 16 20 |
50 | 70 | 55 | 30 um as compensation width should be priorly applied | |||
35 | 30+/-4 | 125 ≤ X+Y | 65<Y1≤75 75<Y1≤85 85<Y1≤ 95 Y1>95 |
6 12 16 20 |
55 | 75 | ||||||||
70 ≤ x <80 | 35 | 30+/-4 | 60 | 140 ≤ X+Y | 65<Y1≤75 75<Y1≤85 85<Y1≤ 95 95<Y1≤ 105 Y1>105 |
6 12 14 18 25 |
60 | 85 | 60 | 35 um as compensation width should be priorly applied | ||||
90 ≤ x <100 | 44 | 39+/-4 | 80 | 166 ≤ X+Y | 24 | 66<Y1≤80 80<Y1≤ 95 95<Y1≤ 115 115<Y1≤ 135 Y1>135 |
6 14 20 25 35 |
66 | 110 | 80 | 43 um as compensation width should be priorly applied | For plated through holes, | ||
100 ≤ x <125 | 49 | 44+/-4 | 90 | 200 ≤ X+Y | 30 | 70<Y1≤ 85 65<Y1≤100 100<Y1≤125 125<Y1≤ 145 Y1>145 |
8 16 22 30 40 |
70 | 130 | 90 | 50 um as compensation width should be priorly applied | For plated through holes, | ||
Compensation widths (um) | Impedance Trace Compensation | Gaps after compensation (um) | Annular ring after compensation (um) | Artwork gaps before compensation (um | Artwork trace widths before compensation (um) | |||||||||
Max. Copper Thickness (um) | Individual traces | Normal | Dense Traces | Normal | Min. | Normal | Local Min. | Normal | Min. | Normal | Min. | |||
X≤ 59 | 80 | 60 | 45 | 2nd outer-most… | 90 | 80 | 180 | 100 | 150 | 125 | 125 | 100 | ||
X≤ 69 | 90 | 70 | 50 | 90 | 85 | 180 | 110 | 160 | 135 | 150 | 126 | |||
X≤ 79 | 100 | 80 | 55 | 100 | 90 | 180 | 130 | 180 | 145 | 175 | 150 | |||
X≤ 83 | 110 | 90 | 60 | 105 | 90 | 200 | 130 | 190 | 150 | 190 | 160 | |||
X≤ 89 | 120 | 95 | 70 | 125 | 100 | 230 | 160 | 220 | 170 | 200 | 176 | |||
X≤ 108 | 130 | 110 | 95 | 130 | 110 | 250 | 180 | 240 | 205 | 240 | 205 | |||
X≤ 115 | 150 | 140 | 120 | 150 | 120 | 270 | 200 | 270 | 230 | 270 | 230 | |||
X≤ 131 | 180 | 160 | 140 | 170 | 150 | 300 | 220 | 300 | 250 | 300 | 250 | |||
X≤ 149 | 210 | 180 | 160 | 200 | 170 | 300 | 250 | 330 | 280 | 330 | 280 | |||
A. Dynanic compensation should be applied if the sum of artwork trace width X + Gap Y before Compensation is less than 160 um. B. For artwork with the Min. trace width, normal compensation widths should be priorly applied. |
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Trace / Space | Refer to the above table | |||||||||||||
Trace – to – Copper | At least 7 mils for electrolytic gold; at least 8 mils for 1 OZ copper board; at least 10 mils for 2 OZ copper board with 9 mils as the extreme. | |||||||||||||
Annular Ring | Refer to the above table | |||||||||||||
Outline | CNC copper to outline: at least 0.2 mm;V-cut: usually 0.7mm or wider for score lines, depending on V-cut depth and angle. |
Pattern Plating +
Max. Dimensions | 200 mm * 1000 mm | |||||
Copper Thickness | 1 – 6 OZ | |||||
Tin Thickness | 200-400 u” | |||||
Hole Wall Thickness | For gold plating board: 15um; For HASL board: 18-25um | |||||
Plugging Paste and Dry Film Tenting | Capabilities of Dry Film Tenting | |||||
Process Board Thickness (mm) | Max. Tenting Diameters (mm) | Min. Annular Ring (Tenting Vias) @Max. Tenting Diameters (mm) | Max. Slot Hole Tenting (mm) | Dual Hole Tenting (mm)” | ||
Outer Layer Negative Film | 1.0 – 3.2 | Φ 5.5 (PTH) | 0.175 | 5.0 * 5.5 (PTH) | Unavailable | |
< 1.0 | Φ 4.0 (PTH) | 0.175 | 3.5 * 4.0 (PTH) | Unavailable | ||
Outer Layer Positive Film | 1.0 – 3.2 | Φ 7.0 (NPTH) | 0.175 | 6.5 * 7.0 (NPTH) | 5.5 | |
<1.0 | Φ 5.5 (NPTH) | 0.175 | 5.0 * 5.5 (NPTH) | Unavailable | ||
Notes: 1. The dry film photoresist is usually 0.2mm expanded by the hole edge. When the hole diameter is no less than 5mm, the annular ring must be 0.2 mm at least. 2. The table above is applicable to automated plugging equipment only, not applicable to vacuum plugging equipment. For flex – rigid boards, vacuum plugging equipments are needed: A. For positive film, the Max. tenting diameter is Φ 2.5 mm, the Max. slot hole is 1.0 mm * 3.0 mm; if NPTH hole > 2.5 mm, 2nd drilling is needed. B. For negative film, the Max. tenting diameter is Φ 1.2 mm, the Max. slot hole is 1.0 mm * 2.0 mm; if PTH hole > 1.2 mm, go through the positive film process. |
Electrolytic +
Nickel Thickness | 100-200 u” |
Gold Thickness | Thin gold 1-2 u”, Thick gold ≤1um (ENIG is suggested if the plated area is over 40% of the total area) |
Solder Mask +
Max. Dimensions | 620 mm * 725 mm |
Thickness +
Thickness | Types of Coating | Solder Mask Thickness (um) | ||||
Traces (A) | Trace Corners (B) | Copper Pour (C) | Substrate (D) | |||
Screen Printing | Finished copper thickness < 60 um | 10 – 25 | 5 – 20 | 10 – 35 | Height over copper surface < 25 um | |
Finished copper thickness ≥ 60 um | 15 – 50 | 10 – 40 | 20 – 35 | Height over copper surface < 30 um | ||
Low-Pressure, Electrostatic Spray | Finished copper thickness < 60 um | 30 – 50 | 15 – 35 | 40 – 60 | Height over copper surface < 35 um | |
Finished copper thickness ≥ 60 um | Unavailable. Linemask process supported with green / matte green solder resist if demanded. | |||||
* For boards that require ≤20 um in solder mask thickness over traces, the finished copper thickness should be no more than 40 um. The upper limit – 25 um in solder mask thickness over traces is advised . If not accepted, a review process is needed. * For boards with BGA pitch ≤0.4 mm that require finished copper thickness within 40um, solder mask thickness by default is 30 um if no specific requirents are proposed. Only screen printing is available. |
Solder Mask Bridge +
Solder Mask Bridge | Position | Finished Copper Thickness | Glossy / Matte Green | Glossy / Matte Black or White | Glossy / Matte with other colors | ||||
Normal | Extreme | Normal | Extreme | Normal | Extreme | ||||
Over Subtrate (A) | ≤ 1 OZ | ≥ 0.07 mm | 0.06 mm | ≥ 0.1 mm | 0.09 mm | ≥ 0.07 mm | 0.065 mm | ||
1 OZ – 2 OZ | ≥ 0.09 mm | 0.07 mm | ≥ 0.125 mm | 0.1 mm | ≥ 0.1 mm | 0.08 mm | |||
≥ 2 OZ | ≥ 0.1 mm | 0.09 mm | ≥ 0.15 mm | 0.125 mm | ≥ 0.12 mm | 0.1 mm | |||
Over Copper (B) | / | ≥ 0.125 mm | 0.1 mm | ≥ 0.15 mm | 0.125 mm | ≥ 0.15 mm | 0.125 mm | ||
BGA (C) | Over Subtrate | ≤ 1 OZ | ≥ 0.055 mm | 0.05 mm | ≥ 0.08 mm | 0.07 mm | ≥ 0.07 mm | 0.065 mm | |
1 OZ – 2 OZ | ≥ 0.065 mm | 0.055 mm | ≥ 0.09 mm | 0.075 mm | ≥ 0.07 mm | 0.065 mm | |||
≥ 2 OZ | ≥ 0.07 mm | 0.06 mm | ≥ 0.1 mm | 0.09 mm | ≥ 0.07 mm | 0.065 mm | |||
Over Copper | / | ≥ 0.125 mm | 0.1 mm | ≥ 0.15 mm | 0.125 mm | ≥ 0.15 mm | 0.125 mm | ||
Solder Mask Opening | Normally 2 mils (>1 mil) expansion by the hole edge (BGA with 20 um expansion). The distance from solder mask openings to traces should be more than 1.5 mils, usually 2.2 mils at the least. |
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Plugged Vias | ≤0.6 mm on 2 sides ≤0.5 mm on 1 side, plugged vias on 1 side are unavailable with HASL. |
Legend+
Line Width / Height | 4 mils/28 mils (0.7mm), 5 mils /35 mils (0.9mm) 2oz copper layer: 4 mils/28mil (0.7mm) . Pay attention to the Line width- to – Height Ratio. |
ENIG+
Nickel Thickness | 100-200 u” |
Gold Thickness | 1-3 u” |
HASL+
Tin Thickness | 0.075 – 40 um |
OSP+
Film Thickness | 0.2 – 0.5 um |
CNC+
Max. Dimensions | 558 mm * 720 mm, segmently slotted if dimensions > 558 mm * 720 mm. |
Milling Cutter Diameter | 0.8 – 2.4 mm, Min. 0.5 mm |
Tolerance | ±0.15 mm or ±0.1 mm depending on requirements |
V-cut+
Max. / Min. Dimensions | Min. 150 mm * 150 mm, Max. 650 mm * 650 mm Min. distance between scoring: 16 mm |
Min. 70 mm * 70 mm, Max. 480 mm * 480 mm with manually operated machine, length to width ratio less than 3 : 1 | |
Angle | 20°, 30°, 45°, 60°, 90° |
Bavel+
Angle | 20°, 30°, 45°, 60° |