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ATE Capability

1 Layers 6Layer Rigid-Flex PCB
2 Material PI-W-1005ED-N4, FR4-IT158TC
3 Copper External 1oz Internal 1oz
4 Line width/space 3/3mil
5 Surface treatment ENIG 2u”
6 Other parameters Warpage ≤ 0.75%
Secondary classification: Planar transformer & thick copper high current power board

1 Layers 8Layer Rigid-Flex PCB
2 Material PI-R-F775 12RB-M, FR4-EM-370(D)
3 Copper external 1oz internal 1oz
4 Line width/space 4/6mil
5 Surface treatment ENIG 2u”
6 Other parameters Warpage ≤ 0.75%

Title: SMT + DIP Full Assembly & High Precision PCBA Assembly
Product Introduction: Application Fields Rail Transit Equipment
Soldering Process Lead-Free Solder Process
PCBA Full Test Service ICT & Functional Test
Component Sourcing & Assembly Original Parts Support
PCBA for Industrial & Medical IPC Class 3 Standard
Mainstream Matching Component Brands Würth, KEMET, Murata, Panasonic, STMicroelectronics
Additional Tests Functional test, aging test, AOI optical inspection, X-ray detection
No. Item Content
1 Finished board thickness 2.4mm
2 Material High-CTI: >600V TG=180
3 Copper external 2oz internal 2oz
4 Layers 6Layer
5 Manufacture IAW IPC-6012D Type2 Class 33
6 Protective Measures Conformal coating & Parylene coating
No. Product capability definition Unit Capability
Item L1（Standard capability） L2（Advanced capability）
1 Finished size mm*mm 50*50 ~ 610*864 50*50 ~ 610*864
2 Board thickness tolerance % ≤±7% ≤±5%
3 Layer No. / ≤80 ≤106
4 Finished board thickness mm 0.5 ~ 8 0.5 ~ 10
5 Core thickness mm ≥0.05 ≥0.05
6 Inner copper thickness μm 18 ~ 70 18 ~ 70
7 Bow&twist % ≥0.3(non BIB)
≥0.75(BIB)		 ≥0.2(non BIB)
≥0.5(BIB)
8 Inner layer impedance line width/space(0.5oz) μm ≥65/80 ≥65/80
9 Inner layer impedance line width/space(1.0oz) μm ≥75/95 ≥75/95
10 Inner layer annular ring after compensation(0.5oz) μm ≥125 ≥125
11 Inner layer annular ring after compensation(1.0oz) μm ≥150 ≥150
12 Inner layer annular ring after compensation(2.0oz) μm ≥165 ≥165
13 Inner layer isolated annular ring after compensation(0.5oz) μm ≥75 ≥75
14 Inner layer isolated annular ring after compensation(1.0oz) μm ≥100 ≥100
15 Inner layer isolated annular ring after compensation(2.0oz) μm ≥150 ≥150
16 Spacing of non-expose copper at inner layer edge μm ≥250 ≥250
17 Inner layer impedance tolerance(non plating layer) % ±5 ±5
18 Inner layer impedance tolerance(plating layer) % ±8 ±5
19 HDI lamination times time ≤4 ≤8
20 Laser via μm 50 ~ 200 50 ~ 200
21 Material for laser vias IT-180A、185HR、TU-768、M6、
RO4350B、E-705G、VT-901		 IT-180A、185HR、TU-768、M6、
RO4350B、E-705G、VT-901、M7
22 Aspect ratio for laser vias ≤0.8 ≤0.8
23 Spacing between laser vias μm ≥75 ≥75
24 Slot hole size for drill slot mm ≥0.4 ≥0.4
25 Min slot width tolerance for slot hole(PTH、hole size≤6.3mm) mm ±0.05 ±0.05
26 Min slot width tolerance for slot hole(NPTH、hole size≤6.3mm) mm ±0.012 ±0.012
27 Min slot width tolerance for slot hole(PTH、hole size＞6.3mm) mm ±0.1 ±0.075
28 Min slot width tolerance for slot hole(NPTH、hole size＞6.3mm) mm ±0.05 ±0.025
29 Spacing between holes in different network(drill slot hole) mm ≥0.4 ≥0.225
30 Min NPTH tolerance (hole size≤6.3mm) mm ±0.012 ±0.012
31 Min NPTH tolerance (hole size＞6.3mm) mm ±0.05 ±0.025
32 Min precision from NPTH to image mm ±0.025 ±0.025
33 Min precision from PTH to image mm ±0.038 ±0.025
34 Min precision from hole to hole mm ±0.025 ±0.025
35 Depth of stepped hole mm ≥0.2 ≥0.2
36 Depth tolerance of stepped hole mm ±0.1 ±0.1
37 Spacing from mechanical hole to conductor
(non whole pcb, 1 times lamination, mechnical through hole)		 μm ≥160@Layer≤80
107 ~ 159@Layer＜62
80 ~ 106@Layer＜48		 ≥160@Layer≤100
107 ~ 159@Layer≤70
80 ~ 106@Layer≤60
68 ~ 79@Layer≤30
38 Spacing from mechanical hole to conductor
(whole pcb, 1 times lamination, mechnical through hole)		 μm ≥160@Layer≤80
≥160@Layer≤100
107 ~ 159@Layer≤64
39 Spacing between hole in different network(mechnical hole) μm ≥215 ≥190
40 Spacing between hole in same network(mechnical hole) μm ≥150 ≥150
41 Mechnical drill size mm 0.13 ~ 6.35 0.11 ~ 6.35
42 Aspect ratio ≤50：1@刀径0.13 ~ 0.20mm
≤40:1@刀径≥0.25mm
≤30:1@刀径=0.11mm		 ≤50：1@刀径0.13 ~ 0.20mm
≤40:1@刀径≥0.25mm
≤30:1@刀径=0.11mm
43 Back drill stub mm 0.25 0.2
44 Back drill pitch mm ≥0.4 ≥0.35
45 Spacing from back drill to conductor μm ≥70 ≥45
46 Max depth of back drill mm 4.3(drilling size 0.25mm)
5.0(drilling size 0.30mm)
5.2(drilling size 0.35mm)
5.5(drilling size 0.40mm)
5.5(drilling size 0.45mm)
6.0(drilling size ≥0.50mm)
3.5(drilling size0.20mm)		 4.3(drilling size0.25mm)
5.0(drilling size0.30mm)
5.2(drilling size0.35mm)
5.5(drilling size0.40mm)
5.5(drilling size0.45mm)
6.0(drilling size≥0.50mm)
47 Outer layer finished copper thickness μm 25-70 25-70
48 Outer layer line width/spacing(finished copper thickness 1oz or 1.5oz) μm ≥90/115 ≥90/115
49 Spacing between pads in outerlayer with positive film before compensation(finished copper thickness 1oz or 1.5oz) mil ≥110 ≥110
50 Outer layer impedance tolerance % ±10 ±5
51 Image precision from pad to pad µm ≥25 ≥25
52 Epoxy filling hole size mm 0.11 ~ 1 0.11 ~ 1
53 Soldermask defined pad size µm*µm ≥200*200 ≥200*200
54 Soldermask defined pad size tolerance µm ±25 ±25
55 Soldermask opening window single side µm ≥25 ≥25
56 Single side width for line covered by soldermask µm ≥65 ≥65
57 Soldermask color Green,matt green,blue,matt blue,black, matt black,Red Green,matt green,blue,matt blue,black, matt black,Red
58 Soldermask bridge(finished copper thickness 25、35μm；except black ,white soldermask) µm ≥100 ≥85
59 Soldermask bridge(finished copper thickness 52、70μm；except black ,white soldermask) µm ≥125 ≥110
60 Soldermask bridge(finished copper thickness 25、35μm，black,white soldermask) µm ≥125 ≥110
61 Soldermask bridge(finished copper thickness 52、70μm，black,white soldermask) µm ≥150 ≥135
62 Legend width/height µm/µm ≥75/500 ≥75/500
63 Spacing between legend µm ≥150 ≥150
64 Spacing from legend to pad µm ≥100 ≥100
65 Silkscreen color white white
66 Gold thickness for hard gold μm 0.1 ~ 1.27 0.1 ~ 10.0
67 production panel size for solder mm*mm 50*50 ~ 680*800 50*50 ~ 680*900
68 Min chip device for SMT 01005 01005
69 SMT QFP pitch mm 0.4 0.4
70 SMT BGA pitch mm 0.4 0.4
71 SMT QFN pitch mm 0.4 0.4
72 Max BGA size for SMT machines mm 90*90 90*90
73 Max BGA weight for SMT machines g 300 300
74 The max height of component mm 25 25
75 Max height of PCBA mm 35 35

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